Half-mm-thick diplexers for mobile designs

January 14, 2014 // By Graham Prophet
AVX says it has the lowest-profile 0603 and 0805 MLO diplexers available: at under 0.55mm in height and exhibiting low insertion losses, low parasitics, and efficient heat dissipation, these diplexers are intended for WiFi, WiMax, mobile telecommunications, and GPS applications

Compared to equivalent low temperature co-fired ceramic (LTCC) products, AVX’s 0603 and 0805 multilayer organic – MLO – dplexers exhibit superior attenuation, low insertion losses, low parasitics, high heat dissipation, and excellent solderability. Ideally suited for band switching in dual and multiband systems, such as WiFi and WiMax (WLAN/BT); mobile telecommunications, including 3G and 4G LTE (WCDMA, CDMA, and GSM); and GPS, the 0603 and 0805 MLO diplexers measure 0.42mm and 0.55mm in height, respectively.

Based on AVX’s multilayer organic high density interconnect technology, the devices help realise high-Q passive printed elements, such as inductors and capacitors in multilayer stack ups. Expansion-matched to PCBs, the devices also provide improved reliability compared to ceramic and silicon components.

Rated for temperatures spanning -40°C to +85°C and, respectively, for maximum power capacities of 4.5W and 5W, they are 100% tested for electrical parameters and visual characteristics and are available with Ni/Au, Ni/Sn, and OSP coatings, all of which are compatible with automatic soldering technologies.

AVX; www.avx.com

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