These are high power TVS devices in low-profile surface-mount packages with design features to minimize thermal resistance and cumulative heating. Microsemi’s plastic large area device (PLAD) technology enables more effective surface-mount TVS packaging for the MPLAD18KP and MPLAD36KP, as it combines a large die size with an exposed bottom contact for heat sinking that improves power handling as compared to through-hole devices. In addition, the devices provide the capability of a bond wire-free part in high vibration environments, supporting high reliability in harsh conditions.
The company says that the high power TVS devices are critical for addressing multiple-stroke and multiple-burst events on aircraft, and offer an efficient low-profile package design in standoff voltage selections of 14V to 40V in either unidirectional or bidirectional construction.
The 18-kW MPLAD18KP and 36-kW MPLAD36KP TVS devices are designed for a variety of applications within the aerospace market, including engine control units, actuator controls, power distribution, power density improvements, environmental controls, communications and instrumental systems. These TVS products, together with the recently launched aerospace power core module with integrated field programmable gate array (FPGA) and hybrid power drive, form an integral part of the power drive electronics architecture on more electric aircraft (MEAs). The devices’ lightning and automotive load dump protection allow their utilization in applications serving the automotive and defence markets, as they can provide a wide range of suppression capability for varying threat requirements either in a single or multiple devices.