High-speed connectors handle data rates above 25 Gbps

January 24, 2014 // By Graham Prophet
MicroSpeed family connectors from Erni Electronics are initially specified for data rates of up to 20 Gbps (using differential pairings). Current measurements and simulations now prove that, with suitable design criteria and layout (-2 dB insertion loss, 5 mm board-to-board spacing), data rates of more than 25 Gbps are possible. This in turn allows extremely fast board-to-board connections with distances of 5 to 20 mm to be realised.

The modular, shielded connectors with 1.0 mm pitch are available as a two-row version with 50 pins for operation in the temperature range -55 °C to +125 °C. In addition to right-angle variants in the two-row design and robust blind-mate versions, seven-row versions with 91 and 133 pins respectively are also available.

Signal contacts feature SMT termination, while two options are available for the shield contacts; SMT or through hole reflow (THR) for particularly heavy plug-in boards or high mechanical loading. SMT coplanarity is fully guaranteed and specified with less than 0.10 mm for all the contacts. The longitudinal pitch of 1.0 mm and the row spacing of 1.5 mm permit horizontal and vertical arrangements of differential pairs or single-ended signals - depending on the application and/or requirement with regard to crosstalk. Optimum crosstalk behaviour can be achieved by means of special layout configurations – with ERNI providing support in the form of field-tested suggestions. Test data for these congfigurations is available. Over 500 mating cycles are specified for the MicroSpeed connectors. Current carrying capacity is 1.0 A for the signal contacts and 6.8 A for the contacts of special power modules.

Demo boards, SPICE models and an evaluation kit are all available for the MicroSpeed connectors. Erni will show this range at Embedded World in Nuremberg (February 25 - 27, 2014, Hall 4, Booth 348).

Erni Electronics; www.erni.com