Theta materials provide the performance needed to maintain outstanding signal integrity (SI) in high speed circuits. They feature a relative dielectric constant of 3.90 at 1 GHz and low dissipation factor of 0.009 at 1 GHz for excellent low loss performance. Theta materials are designed for high reliability, with a low coefficient of thermal expansion (CTE) of only 50 ppm/°C in the z direction, or about 30% less expansion than standard FR-4 circuit materials for the same temperature range. This translates into improved reliability of plated through holes (PTHs), buried blind, and stacked vias in multilayer structures requiring multiple lamination cycles.
RT/duroid 6035HTC laminates are designed for applications where high reliability is required, for example in circuits for military and aerospace systems. These high performance materials incorporate a unique filler material to achieve a relative dielectric constant of 3.5 in the z-axis at 10 GHz with extremely high thermal conductivity of 1.44 W/m-K. RT/duroid 6035HTC circuit materials are ideally suited for high frequency, high power circuits, including amplifiers, couplers, filters, and power combiners/dividers. The high thermal conductivity, combined with a low loss tangent of 0.0013 at 10 GHz, enables circuit designers to optimize gain and efficiency in high-power amplifiers.
In addition, visitors can learn more about MCL-FX-2 laminates, which support high speed digital circuits at rates exceeding 1 Gb/s. These high performance circuit materials are manufactured with prepregs supplied from Hitachi Chemical Co., Ltd., as part of a strategic collaborative agreement between the two companies.