Industrial thin Mini-ITX motherboard hosts 7th-gen Intel Core cpu

March 08, 2017 // By Graham Prophet
congatec’s conga-IC175 is a thin industrial-grade motherboard family featuring Intel’s 7th Gen Core U (Kaby Lake) processors designed for IoT connected devices. The new boards are suited for space-constrained, high-performance, low-power IoT designs.

Besides all the enhancements of the new processor generation, they also offer comprehensive IoT support including a SIM card socket for 3G/4G or Narrow Band connectivity and first versions of congatec’s Cloud-API, to be demonstrated at Embedded World (Hall 1, Booth 358).


The low profile design suits it for slim system designs such as industrial GUIs/HMIs, digital signage systems, point-of-sale terminals, and medical tablets. The boards have the option of ultra-fast Intel Optane memory via M.2 connector, enabling extremely fast system boots, application starts, video recording and processing, and software updates. The boards support Hyper-Threading which turns the dual-core design into a 4-in-1 system when utilizing the RTS real time hypervisor.


The Thin Mini-ITX motherboards can, the company adds, be universally employed in all embedded and IoT applications as the new low-power versions of the high-end 64-bit Intel Core processors offer a highly configurable thermal design power (TDP) of 15W, with the flexibility to scale dissipation from 7.5W cTDP to 25W cTDP for an exceptional balance of power and performance.




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