Industry's first molded chip scale package offers power benefits for space-constrained portable devices

August 31, 2012 // By Paul Buckley
Alpha and Omega Semiconductor Limited (AOS) has introduced what the company claims is the industry’s first Molded Chip Scale Package (MCSP) in a 0.97 mm x 0.97 mm x 0.3 mm power package.

The AOC2403 is a 20 V 95 mOhm P-Channel MOSFET housed in a halogen-fee MCSP. The package dimensions are 0.97 mm x 0.97 mm x 0.3 mm. The AOC2403 is the cornerstone on which additional first-class MCSP products are being developed.

Compared to existing Chip Scale Package (CSP) solutions, MCSP reduces package height by 50% and improves the mechanical robustness of the package by protecting the encapsulated die with a layer of molding compound. The performance improvements of the MCSP technology make it ideal for the latest ultra-portable applications such as smart phones, tablet PCs, UltraBooks and other mobile hand-held devices.

MCSP can easily replace a standard CSP by offering the same footprint, pin-out, and pitch, with the benefits of a more rugged and ultra-thin package. The MCSP encapsulates AOS’s low on-resistance MOSFET silicon in a Green (halogen-free) molding compound, which end result is to give it a thinner and more robust structure to solve die chipping and placement issues associated with standard CSP products

Availability and Pricing

The AOC2403 is immediately available in production quantities with a lead-time of 12 weeks.  The unit price for 1,000 pieces is $0.35.

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