Infineon adds MOSFETs to 1200V silicon carbide device offering

May 05, 2016 // By Graham Prophet
Infineon has disclosed a silicon carbide (SiC) MOSFET technology that it says will enable, “unprecedented efficiency and performance” in power conversion designs for, “previously unattainable” levels of power density and performance. CoolSiC MOSFETs promise a new degree of flexibility for increasing efficiency and frequency.

The 1200V SiC MOSFETs will operate with ‘benchmark’ dynamic losses that are an order of magnitude lower than 1200V silicon (Si) IGBTs. This initially supports system improvements in applications such as photovoltaic inverters, uninterruptible power supplies (UPS) or charger/storage systems, while later configurations will also extend support to industrial drives.


The MOSFETs are fully compatible with the +15 V/-5 V voltages typically used to drive IGBTs. They combine a threshold voltage rating (V th) of 4V with short-circuit robustness required by the target applications and fully controllable dv/dt characteristics. Key benefits over Si IGBT alternatives include temperature-independent switching losses and threshold-voltage-free on-state characteristics.


The first discrete 1200V CoolSiC MOSFETs feature on-resistance (R DS(ON)) ratings of 45 mΩ. They will be available in 3-pin and 4-pin TO-247 packages targeted at photovoltaic inverters, UPS, battery charging and energy storage applications. Both devices are ready for use in synchronous rectification schemes thanks to the integration of a commutation robust body diode operating with nearly zero reverse recovery losses. The 4-pin package incorporates an additional (Kelvin) connection to the source, which is used as a reference potential for the gate driving voltage. By eliminating the effect of voltage drops due to source inductance, this further reduces switching losses, especially at higher switching frequencies.


The MOSFETs are based on a trench semiconductor process and represent the latest evolution of Infineon’s family of CoolSiC technologies. This family includes Schottky diodes and 1200V J-FET devices, and a range of hybrid solutions that integrate a Si IGBT and SiC diode in a module device.


Infineon has also announced 1200V ‘Easy1B’ half-bridge and booster modules based on the SiC MOSFET technology. Combining PressFIT connections with a good thermal interface, low stray inductance and robust design, each module is available with R DS(ON) rating options of 11 mΩ and 23 mΩ.


The company adds, “Infineon has manufactured millions of products containing SiC devices,