“The research results from eRamp will be an important contribution to even more efficiently use energy,” according to Dr. Reinhard Ploss, CEO of Infineon Technologies AG. “The partners in the eRamp project have the entire power electronics value creation chain in mind, from generation and transmission all the way to consumption of electric energy. Together we will create new knowledge and thus new products that will mean economic and ecological progress for Europe.”
eRamp research activities will focus on the rapid introduction of new production technologies and further exploration of chip packaging technologies for power semiconductors. The German project partners will investigate and develop new methods for speeding up the start of the production run.
In order to investigate research results for practical viability exactly where the new production technologies will be implemented, the German research partners will use existing pilot lines and comprehensive production expertise at various German sites, including Dresden (Infineon: power semiconductors based on 300mm wafers), Reutlingen (Bosch: power semiconductors, smart power and sensors based on 200mm wafers) and Regensburg (Infineon: chip packaging technologies for power semiconductors). Infineon, Osram and Siemens will work together closely to research and construct testing equipment and demonstrators for the evaluation of newly developed chip embedding technologies.
In Germany, the Technical University of Dresden and West Saxon University of Applied Sciences Zwickau are also participating in research. In total, there are 26 research partners from six countries, listed at Infineon’s website; www.infineon.com/cms/en/corporate/press/news/releases/2014/INFXX201404-033.html