Infineon offers high-power module IP royalty-free, to spread adoption

December 11, 2014 // By Graham Prophet
Infineon has announced two power module platforms designed to improve the performance of high-voltage IGBTs in voltage classes from 1200V up to 6.5 kV. To make the benefits of the new module broadly available, Infineon is offering a royalty-free license of the design to all providers of IGBT power modules.

First products using the platform concept will include high voltage classes 3.3 kV (450A), 4.5 kV (400A), and 6.5 kV (275A) in a newly-designed package measuring 100 x 140 x 40 mm. The new modules will first be shown publicly during the PCIM exhibition, which will take place in Nuremberg from May 19 – 21, 2015. A package design for lower voltage classes is being developed.

Infineon asserts that developments over time have shown, “little modification to the standard packaging technology”, in modules used by industrial and traction drives, wind and solar energy systems and long-distance electrical transmission. Through a more than twenty-year history of use, chip technology developments have allowed IGBTs to meet demands for higher energy efficiency and higher operating temperature, as well as miniaturisation, reliability and cost reduction. As applications face more and more demanding and harsh environments this approach is reaching its limit, Infineon believes, making a change in package technology of high-power modules a key to continued performance improvement.

The company says that its new module platform addresses emerging system requirements for high-power density, low inductance, energy efficiency, long lifecycle and robustness. Its flexible concept allows the connection of similar parts in parallel, enabling a simplified structure to be used for the DC link terminal and capacitor. The AC terminals can be connected in parallel with only one busbar. The flexibility and scalability of the new modules will simplify system design considerably, thus supporting the time-to market requirements of developers. Using the latest package technology the new high-power module also will help to reduce overall system cost and ensure future-proofing of designs.

“Taking into account the increasing challenges IGBT technology is facing, we are very pleased to present a package that answers the needs of our industry both for today and for the foreseeable future. We are most certain that the new module package will be of great benefit for all demanding high-power applications,” said