Integrated laser/photonics module for 100G datacentre applications

March 14, 2016 // By Graham Prophet
MACOM’s MAOP-L284CN L-PIC integrates lasers with silicon photonic integrated circuits; the device offers a 100G transmit solution for CWDM4 and CLR4 applications.

So-called hyper-scale datacentres will require high-speed interconnect solutions that are power efficient, compact and cost optimised. MACOM’s Etched Facet Technology (EFT) lasers are attached to the Silicon PIC using its proprietary Self-Alignment process (SAEFT) with high coupling efficiency, offering a power efficient solution at reduced manufacturing cost.

 

MAOP-L284CN hosts four high bandwidth Mach-Zehnder modulators integrated with four lasers (1270, 1290, 1310, and 1330 nm) and a CWDM (coarse wavelength division multiplexer), with each channel operating at up to 28 Gb/sec. The L-PIC operates on a standard single mode optical fibre, and includes integrated tap detectors for fibre alignment, system initialisation and closed loop control. A single fibre aligned to the output edge coupler of this 4.1 x 6.5 mm die is the only optical requirement for implementing this device into QSFP28 transceiver applications. MACOM is also offering the MASC-37053A modulator driver integrated with CDR, matched with this L-PIC for optimized performance and power dissipation.

 

MACOM; www.macom.com