Circuit carriers of the three-dimensional circuit boards are produced at Beta LAYOUT using 3D printing. This eliminates the need for costly injection moulding dies, as commonly used in series production. After this, the MID components are processed on a special production line using laser direct structuring, and then assembled. These technologies make 3D MID circuit carriers economically feasible even for companies with small production volumes. The 3D MID CAD program will soon be available on the company's website as a free download add-on to the TARGET 3001! PCB POOL version, allowing developers to design and lay out 3D MID components themselves.
Visit Beta LAYOUT at www.beta-layout.com