LDOs come in bump-less chip scale packaging for wearables

August 05, 2016 // By Graham Prophet
STMicroelectronics has placed a low-dropout regulator (LDO) in an ‘ultra-tiny’ chip-scale package. LDBL20 is a 200 mA LDO in a 0.47 x 0.47 x 0.2 mm chip-scale package for wearable and portable devices and for flexible electronics such as multifunction connected smart cards.

The LDBL20’s bumpless STSTAMP package breaks through the minimum I/O-area and height limitation imposed by the diameter of traditional flip-chip solder bumps, enabling, ST says, unprecedentedly small footprints and low mounted heights. The LDBL20 extends ST’s family of compact LDOs, which includes devices from 2 x 2 mm DFN to a 0.69 x 0.69 mm CSP with 300 mA output.


LDBL20’s 200 mA output makes it as powerful as larger devices. The input voltage can range from 1.5V to 5.5V, with 200 mV typical dropout. Rejection (PSRR) of 80 dB at 100 Hz and 50 dB at 100 kHz simplifies filtering over a wide frequency range to provide a stable rail for low-power circuitry in battery-operated applications. Quiescent current of 20 µA no-load, 100 µA full-load, and 0.3 µA in standby help maximize efficiency under all operating conditions.


A wide range of output voltages is available on request, from 0.8V up to 5.0V in 50 mV increments. Built-in features include logic-controlled electronic shutdown, internal soft-start, and support for active output-voltage discharge if required.


An evaluation board for the LDBL20, STEVAL-ISB034V1, is also available, which assists design-in to a wide range of products such as fitness and blood-pressure monitors, glucose meters, hearing aids, wearable sensors, smart headphones, portable audio devices, smart plugs, smart watches, and smartcards.


LDBL20 is priced from $0.25 (1,000).


ST; www.st.com