These Chip-On-Board LED filaments create the same amount of light, while consuming less energy and offering longer life than the traditional tungsten incandescent light bulb, to provide reliable and efficient lighting solutions.
The LED filaments are designed with unique terminations so that they can be handled and spot-welded by existing high volume fully automated glass lamp manufacturing lines. Plessey has incorporated a customised approach to controlling the current and Vf (forward voltage) of the filaments when the filaments are driven in a bridge configuration.
Plessey’s CTO, Dr. Keith Strickland, said, “We have taken our existing Chip-Scale-Packaging technology, also used for our dotLEDs, into a revised format for the filament. Not only do we have an improvement in terms of manufacturability with GaN-on-Silicon, and [have] enhanced power control for filament resistors, but Plessey will also be incorporating other active and passive electronic components for Chip-On-Board and Chip-Scale-Packaging solutions in the next generation of filaments. Thermal performance and customisation are key to our filament product portfolio, and Plessey remains committed to bring to market unique LED products through our integrated approach to solid state lighting applications.”
Plessey’s PLF series of filaments come in a variety of lengths, light output and colour temperatures (CCT) from very warm 2200K to 6500K.
Plessey Semiconductors; www.plesseysemiconductors.com