The LIN protocol handler is compliant with LIN 2.0, LIN 2.1 and LIN 2.2, as well as SAE J2602. The ICs have 4 high voltage capable (12V direct) IOs, plus eight low voltage capable (5V) Ios. Every IO can be programmed to control the application components using the built-in Flash memory resource.
High levels of integration reduces both the bill of materials (BoM) costs and board space utilisation. The combination of the LIN controller and approved LIN driver together with directly controlled high/low voltage capable IOs means that LIN can be implemented into a wide variety of different applications. As these ICs are supplied in 5 x 5 mm QFN packages, thermal performance is maximised and board real estate is conserved. Operational temperature range is -40°C to 125°C with over-temperature shutdown and load dump (40V) protection.
The company adds that the chips facilitate the development of considerably smaller LIN modules with lower price tags.