Low-profile connector system increases stacking density

March 21, 2013 // By Graham Prophet
Samtec’s line of Razor Beam interconnects now includes an ultra low profile, micro pitch system for high speed performance in space saving applications.

Razor Beam LP low profile socket and terminal strips (SSH/STH Series) achieve a low 2.00 mm stack height with surface mount termination to the board: 2.50 mm and 3.00 mm stack heights are currently in design. This 0.50 mm (.0197") pitch interconnect system features contacts designed for micro pitch and low profile interfaces. The system features a double row, slim body design for increased PCB board space savings with 20, 40, and 60 total pin counts: 80 and 100 total pin counts are in development. Weld tabs are optional for easy board processing as well as for more rugged applications. The range also includes a low profile, ultra-fine 0.40 mm (.0157") pitch system (SS4/ST4 Series) with stack heights from 4.00 mm to 6.00 mm. The socket and terminal strips feature up to 100 positions on a double row, extra narrow body design for PCB real estate savings.

Razor Beam interconnects include micro rugged hermaphroditic interfaces for high speed/high density applications. These self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility. The slim row-to-row design is available on 0.50 mm (.0197") pitch (LSHM Series), .250” (0.635 mm) pitch (LSS Series) and 0.80 mm (.0315") pitch (LSEM Series) systems for parallel, perpendicular and coplanar applications. More at www.samtec.com