Low-profile packaging for power MOSFETs

May 19, 2014 // By Graham Prophet
Infineon has introduced a leadless surface mounted package for its CoolMOS MOSFETs; ThinPAK 5x6 is intended to expand the use of these FETs in adapters, consumer electronics and lighting applications

Chargers for mobile devices, Ultra High Definition TVs and LED lighting all have to meet numerous conflicting requirements. Consumers expect slim yet high performing products. Therefore, manufacturers demand compact, cool and cost efficient semiconductor solutions. These considerable space constraints can be resolved by reducing the size and weight of the components which occupy printed circuit board (PCB) area.

For chargers, there is a clear trend towards smaller, faster and more efficient solutions. With its height of only 1mm and with its very small footprint of 5 x 6 mm the ThinPAK 5x6 provides 80% volume reduction in comparison to traditional SMD packages such as DPAK. Thus, manufacturers gain flexibility for the design of even smaller chargers. The very low parasitics of ThinPAK – such as low source inductance compared to the traditional DPAK – reduce the gate oscillation under all load conditions and minimise voltage overshoots during switching by 40% in comparison to traditional SMD thus improving device and system stability and ease of use.

ThinPAK 5x6 offers engineers more flexibility in their PCB designs and better switching performance ultimately leading to more efficient power conversion while reducing overall system size in applications such as low power adapters, lighting and thin panel TVs. It follows the earlier release of the ThinPAK 8x8 for higher power applications such as server and telecom SMPS.

Infineon; www.infineon.com/ThinPAK5x6