Low-resistance, high current-to-PCB connector system, in distribution

August 25, 2015 // By Graham Prophet
Distributor TTI has Amphenol’s RADSOK Power to Board product that is designed to deliver higher current at lower temperatures, and to save space and weight. Suggested application spaces include communications, industrial, and DC power distribution systems.

Amphenol’s RADSOK offers many options for delivering high current and single-point connections to PCBs, all incorporating Amphenol’s RADOK technology, which is designed specifically to meet today’s demand for higher current, more efficient power connections to achieve greater system integration. The RADSOK Power to Board product line has a current carrying capability of up to 200A and with to its hyperbolic lamella socket contact construction, delivers higher current at lower temperatures than traditional contact systems.

RADSERTs are versatile, low profile, single point high current contacts that can be applied to a PCB or busbar. Featuring enhanced lead in and mis-alignment tolerance, they have current carrying capability up to 120A, are suitable for blindmate applications and are available in press-fit or solder version termination styles.

PowerBlok connectors have a robust mechanical design with multiple redundant points of electrical contact ensuring reliability. With current rating up to 200A, RADSOK contacts and a small footprint, they are intended for applications where space and weight are critical. Generous mis-alignment tolerance or “float” handles blindmating situations. For high-speed backplane and midplane applications, PowerBlok has press fit compliant pin termination.

PGY is a family of orthogonal card edge connectors carrying up to 200A available in multiple sizes. Featuring a very robust mechanical design, PGY card edge connectors are optimised to dissipate heat and deliver high power to the PCB evenly. They are highly suitable for blindmate drawer applications.

PowerBlok WTB (Wire to Board) is a line of low profile wire to board connectors with a current rating up to 70A. In vertical or horizontal mating planes as single-point contact terminals, they use Amphenol’s RADSOK technology. A removable lock housing ensures mating to the board remains intact even under harsh vibration conditions. Designed for pin through hole placement, they are supplied in tape and reel packaging.

Via distributor TTI, Inc; www.ttieurope.com