The EZLinkLTE modules are based on Sequans’ LTE baseband and give device designers a plug-and-play, all-in-one LTE connectivity solution that significantly reduces development cost and time to market. The first EZLinkLTE module is the VZ20Q, which is one of the first modules in the industry to support both LTE bands 4 and 13.
The baseband chip at the heart of the new module is Sequans’ SQN3120 Mont Blanc chip that was certified by Verizon Wireless in 2012. The chip is compliant with 3GPP release 9 and it delivers category 4 throughput of up to 150 Mbps in the downlink. Starting with the SQN3120 chip, the VZ20Q integrates all other elements necessary for a complete LTE modem system. These include an LTE-optimised RF transceiver provided by Sequans’ RF partner, Fujitsu Semiconductor, a complete dual-band RF front-end for bands 4 and 13, LP-DDR SDRAM, embedded boot Flash, and VC-TCXO, all in a single, surface-mountable package with a very compact footprint, 17 x 24 x 2 mm.
“Our EZLinkLTE modules provide great value to device designers in terms of cost savings and reduction of development risk and time,” said Georges Karam, CEO of Sequans. “The EZLinkLTE modules are pre-integrated, pre-tested, and pre-certified by carriers, meaning that we’ve done most of the heavy lifting in advance and can offer device makers a very quick and easy solution for adding LTE connectivity to many types of devices.”
EZLinkLTE modules are designed to provide a comprehensive LTE connectivity solution for the design of connected consumer electronics devices, tablet and laptop computers, machine-to-machine devices, and other applications featuring embedded LTE connectivity. It is delivered with Sequans’ 4G-EZTM software package, which includes an LTE Release 9 protocol stack along with OMA-DM and IMS clients. It supports all major operating systems, including Windows, Android, Linux, Google Chrome, and MAC OS, for maximum versatility. The VZ20Q is engineered for fast, reliable, and secure LTE connections.