Applications include enterprise networking towers, telecommunication hubs and servers, industrial controllers, and medical and aerospace/defence high-data-rate scanning equipment.
Comprising a vertical plug and vertical receptacle, the NeoScale High-Speed Mezzanine System features a modular triad wafer design that enables customisable PCB routing in high-density applications. The system’s Solder Charge Technology PCB attachment method delivers robust solder joints. Designers can select from 85 Ohm, 100 Ohm, power triad and low-speed signal options to build a mezzanine solution. The connector design can also be blind mateable with rugged triads for multiple connectors.
The modular NeoScale triad wafer is comprised of three pins per differential pair – two signal pins and one shield pin. Each triad is a standalone, shielded, 56-Gbps-capable differential pair: or an 8A power feed. Triads can be optimised for signals supporting high-speed 85 Ohm or 100 Ohm differential pairs, high-speed single-ended transmissions, low-speed single-ended/control signals, and power pins.
“The NeoScale High-Speed Mezzanine System uses differential pair triads with dedicated ground shields to offer exceptionally clean signal transmission compared to other mezzanine connectors,” said Nadine Dytko-Madsen, global product manager, Molex, adding, “The NeoScale High-Speed Mezzanine System is completely customisable so designers can populate it according to their needs [and] it can effectively replace four connectors, so it offers major PCB real estate savings.”
Molex contends that alternative mezzanine options offer high-speed differential pairs either at 90 to 92 Ohms to accommodate the 85 to 100 Ohm range, or they offer mezzanine options with only 85 or 100 Ohm options. The NeoScale High-Speed Mezzanine System allows designers to run 85 and 100 Ohm high-speed signals through one connector – plus low-speed, single-ended signals (three signals per triad) and power.
The system’s honeycomb housing routes each triad to minimise crosstalk and effectively route out of the PCB in one or two layers, reducing the need for PCB real estate. In addition, “pillar of strength” structures in the housing