Benefiting from its industry-leading integration levels and utilizing high-performance SiGe process technology, the new LX5586 RF FE provides significant performance and cost advantages over existing technologies.
The RF FE is designed to be used in conjunction with Broadcom's BCM4335 combo chip for mobile platforms such as smartphones and tablets. BCM4335 is the industry's first combo chip solution based on the IEEE 802.11ac standard, also known and widely deployed as 5G WiFi.
"We're pleased to enter the 802.11ac market in collaboration with Broadcom," said Amir Asvadi, vice president and general manager at Microsemi. "The LX5586 is the smallest, most reliable, highest performance solution in the marketplace today and the first in a series of highly-integrated Wi-Fi subsystems we are introducing to our customers. This innovative front-end solution provides Broadcom's 5G WiFi devices with inherent reliability and cost advantages over traditional multi-chip front-end modules."
"Broadcom is enabling the 5G WiFi ecosystem across all major wireless product segments," said Rahul Patel, Broadcom vice president, Mobile Wireless Connectivity Combos Group.
Microsemi LX5586's features include a fully integrated, single chip 802.11ac 5GHz PA, LNA with bypass and SPDT antenna switch.
The device, which has a small footprint of 2.5x2.5 mm and 0.4mm height, delivers ultra linear power of 16 dBm at 1.8 percent EVM, 256QAM modulation over 80 MHz bandwidth. There is high ESD protection of 1000V (HBM) on all pins.
The LX5586 is packaged in a 2.5 x 2.5 mm 16-pin QFN.
More information on Broadcom's BCM4335 Wi-Fi chip at