“Automotive-grade qualified SmartFusion2 and IGLOO2 devices assure the safety of users’ design, data and hardware in respect of tampering and cloning,” according to Bruce Weyer, vice president and business unit manager at Microsemi. “...the devices’ single event upset (SEU) immunity offers protection from neutron-induced firm errors, helping engineers achieve zero defect rate—an essential requirement in the automotive industry.”
These devices are presented as the most suitable alternative to ASICs providing a low power, cost-effective, secure and reliable solution for automotive applications including advanced driver assistance systems (ADAS), vehicle-to-vehicle/vehicle-to-everything (V2V/V2X) communication and electric/hybrid engine control units.
SmartFusion2 (“SoC devices”) integrate flash-based FPGA fabric, a 166 MHz ARM Cortex-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and communication interfaces on a single chip For more information visit: http://www.microsemi.com/products/fpga-soc/soc-fpga/smartfusion2
IGLOO2 FPGAs address the cost-optimised FPGA market with a LUT-based fabric, 5G transceiver, high speed GPIO, block RAM, high-performance memory subsystem, and DSP blocks in a cost and power optimized architecture, combining non-volatile Flash-based fabric with general purpose I/O, 5G SERDES interfaces and PCIe end points.
Microsemi’s automotive-grade FPGAs and SoC FPGAs will be available in July 2015; www.microsemi.com/applications/automotive