Miniature amplified digital pressure sensors suit IoT applications

August 19, 2015 // By Graham Prophet
Honeywell’s Amplified Basic Pressure (ABP) sensor is positioned as one of the smallest amplified digital pressure sensors available. The accurate, 8 x 7 mm sensors use low power levels, to add pressure measurement to systems that fit on increasingly smaller and lower power devices.

The ABP sensor features wet-media compatibility, as well as sleep mode and temperature output options, making it a versatile choice for Internet of Things (IoT) applications. The sensors are claimed to be among the most accurate of their kind with a ±1.5% total error band (TEB), and capable of reading pressure ranges from 60 mbar to 10 bar, 6 kPa to 1 MPa and 1 psi to 150 psi. This will enable engineers to better optimise system performance by improving resolution and system accuracy.

“Low power systems and the ‘Internet of Things’ are expanding into many industries. As a result, engineers have more pressure now to develop not just smarter, but smaller systems to fit these emerging trends,” said Dan Herzog, product line director, Honeywell Sensing and Productivity Solutions. “Our amplified digital basic pressure sensors were designed to help engineers meet these aggressive design goals by saving valuable space and cost without compromising the end product’s performance.”

The release of the new ABP sensors expands Honeywell’s Basic Pressure Sensors portfolio, which launched in 2012 and includes both uncompensated (NBP) and compensated (TBP) versions. The added ABP sensor will be the first amplified pressure sensor in this series that will simplify installation by minimising the need for additional components and engineering time to design the sensor into the application. The sensor is available in both analogue and digital output, I ²C or SPI.

The new sensor’s moisture sensitivity level of one will allow for unlimited shelf life when stored at <30ºC/85% RH. Under most storage conditions, this allows for the sensor to be soldered onto the PC-board without concerns about solder joint quality due to ageing of the sensor terminals, minimising the concern about ageing of the terminals prior to assembly to the PC-board.