Molex’ MediSpec puts advanced medical technologies in mini 3D package

December 03, 2014 // By Graham Prophet
Integrating fine-pitch circuitry, Molex’ MediSpec Moulded Interconnect Device/Laser Direct Structuring (MID/LDS) is a 3D technology that combines advanced MID capability with LDS antenna expertise, to deliver fine-pitch 3D circuitry in a single moulded package suitable for high density medical devices while meeting stringent medical grade guidelines.

Addressing functionality, space, weight and cost savings, the MediSpec MID/LDS 3D technology blends the versatility of the two-shot MID moulding process with the speed and precision of LDS. Scalable from small to large volume production quantities, LDS uses a 3D laser to image micro-line electronic circuitry onto a variety of RoHS-compliant moulded plastics, which allows for pattern modification with lines and spaces down to 0.10 mm and circuitry pitch down to 0.35 mm.

“Surpassing the capabilities of existing 2D technologies, MediSpec MID/LDS 3D shielded circuitry allows medical device designers to integrate highly complex electrical and mechanical features into highly compact applications,” states Steve Zeilinger, group product manager, Molex.

Molex provides design and manufacturing experience to customise MediSpec MID/LDS selective trace solutions with miniaturised connectors, circuit vias, switch pads, sensors or even antennae. Suitable for SMT applications meeting specific mechanical requirements, integrated chips, capacitors and inductors can be soldered directly to the selective plating on the RoHS-compliant plastic. Insert and overmoulding allows for built-in features to reduce weight and increase functionality.

MediSpec MID/LDS 3D packaging is suitable for blood glucose meters, home healthcare telemetry, catheter interfaces, pulse oximetry sensors, hearing aids, and a range of other medical device applications. In addition to full scope engineering support, Molex provides MID/LDS quality control testing to ensure product reliability and performance criteria are met.

“An excellent value proposition for miniaturisation strategies, our MediSpec 3D interconnect package delivers significant space savings over traditional PCB and flex circuit designs,” adds Zeilinger. “ to address miniaturisation, convergence and healthcare trends in the medical industry.”