Based on AVX’s multilayer organic (MLO) high density interconnect technology, the HF Series MLO high pass filters utilize high dielectric constant and low loss materials to integrate high Q passive printed elements, such as inductors and capacitors, in multilayer stacks with land grid array surface mount packaging that’s expansion-matched to most organic printed circuit board materials, providing improved reliability over standard silicon and ceramic devices. Exhibiting low insertion loss, excellent rejection of out of band frequencies, low parasitics, favourable heat dissipation characteristics, and 50Ω impedance, the HF Series filters feature an ultralow maximum profile height of 0.559 mm, and support both a wide frequency range (0.74 GHz – 2.83 GHz) and several wireless standards, suiting them for use a variety of wireless applications, including: mobile communication devices, global positioning systems (GPS), vehicle location systems, wireless local area networks (LAN), satellite receivers, and instrumentation.
Claimed benefits include lower insertion loss, better attenuation, and better heat dissipation than designs that utilize LTCC products. HF Series MLO high pass filters are currently available in five case sizes with varying lengths (6.579 mm ±0.05 mm, and 7.785 mm, 8.674 mm, and 10.198 mm, ±0.254 mm) and fixed widths and heights (3.97 mm and 0.559 mm, ±0.254 mm, respectively), and are supplied with gold terminations that are compatible with automatic soldering technologies including: reflow, wave soldering, vapour phase, and manual. The series is rated for operating temperatures spanning -55°C to +85°C.
AVX (a Kyocera company); www.avx.com/products/rfmicrowave/filters/multilayer-organic-mlo-high-pass-filter/