Multitest improves power delivery for PCBs under test

May 27, 2014 // By Christoph Hammerschmidt
The board division of semiconductor test equipment vendor Multitest now offers new features to increase the electrical performance for PCBs. Capacitor implants allow for placing the single capacitors close to the device under test (DUT), whereas the capacitance core is placed as a layer between the power and ground layer. Both methods can decrease loop inductance in the power delivery network and support ambient-hot-cold applications from -55°C to +120°C.

Capacitor implants are available in DUT pitches from 1.0 mm to 0.5 mm. They provide substantially reduction of inductance and impedance and support resonance or tuning for noise reduction. In high speed applications they can be applied to minimize voltage drop. Multitest also offers cost effective daughter card solutions to leverage these benefits.

The embedded capacitance cores aim at high volume test and support any DUT pitch. They are capable of 900 pF per square inch.

Multitest signal integrity experts work with customers to determine if traditional power delivery will meet customer test demands, and can simulate the embedded capacitance methods to help decide the best solution for their application.

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