New thin-film thermoelectric modules offer higher cooling capacity and lower heat flux density

November 14, 2012 // By Paul Buckley
Nextreme Thermal Solutions has introduced a new series of thin-film thermoelectric modules that offer higher cooling capacity, robust mechanical design and source-matched heat flux density for easier integration into existing electronic systems.

At 1.1 mm high, the new eTEC MA8000 Series is designed to provide low-profile thermal management solutions for medium heat flux applications in markets including photonics, electronics, test and measurement, and aerospace.

The MA8000 Series includes five new modules that can pump from 10 to over 80 watts of heat at an ambient temperature of 25°C with footprints ranging from 63 to 375 mm². With heat flux densities ranging from 16 W/cm² to 22 W/cm², the MA series offers the ability to match thermoelectric cooling designs more easily to heat sources and existing convection-based heat rejection systems. The new modules fill the gap between traditional thermoelectrics that offer 6-8 W/cm² and Nextreme's HV series that pumps heat in excess of 100 W/cm².

The MA8000 series features a high-strength seal ring made from Cirlex polyimide film that provides mechanical isolation across the thermoelectric device, virtually eliminating vertical force and sheer issues. The seal ring also serves as a barrier to moisture and other contaminants that could affect the performance of the module.


Commercial shipments of the eTEC MA8000 series will begin in the first quarter of 2013. Pricing is available upon request.

Laird Technologies is the exclusive global reseller for Nextreme thermal management and power generation products.

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