Nexperia qualifies small-outline power FET package to automotive specs

March 15, 2017 // By Graham Prophet
Nexperia, the former Standard Products division of NXP, now operating as an independent company, has qualified its 3 x 3 mm outline LFPAK33 package for use with automotive MOSFETs, and says that the result is a thermally-efficient product that is 80% smaller that comparable parts.

LFPAK33 is an “SO-8-style” package in reduced size; it features a no-bond-wire construction with the FET die sandwiched in a leadframe for high thermal conductivity and low resistance and inductance. The resulting package has a footprint of 10.9 mm ², and operating temperatures of up to 175oC Tj max are possible. Devices can handle up to 70A, and the product portfolio includes devices that range between 30 V – 100 V and an RDS(on) as low as 6.3 mΩ.

Target applications include: connected auto modules, next generation engine management systems; chassis and safety technology; LED lighting; relay replacement; C2X, radar, infotainment and navigation systems; and ADAS.