Multisim 13.0 is a SPICE simulation environment used by educators, students and engineers worldwide to explore, design and prototype circuits. Features of release 13.0 include;
· Circuit parameter and parameter sweep analysis
· Digital circuits education with NI myRIO and Digilent FPGA targets
· Power electronics analysis with IGBT and MOSFET thermal models
· Device library of 26,000+ components
· Design automation with the Multisim API Toolkit for LabVIEW system design software
Multisim 13.0 offers circuit analysis tools for analogue, digital and power electronics. The graphical, interactive environment helps educators reinforce circuit theory and bridge the gap between the classroom and hands-on laboratory learning. The same advanced Multisim analysis capabilities are also used in various industries to explore design decisions and optimise circuit behaviour with mixed-mode simulation.
Multisim is also a complete education solution for multiple courses, takes students from basic electronics comprehension to complex final-year design projects through courseware and laboratory hardware integration. Multisim 13.0 also has ready-to-use daughterboard templates to speed design time for NI Single-Board RIO hardware.
“We chose Multisim for the breadth it provides us, allowing first year undergraduate students to understand fundamental analogue and digital electronics, but also the depth so that final year masters students can use it in their projects,” said Danielle George, Faculty Member of Engineering and Physical Sciences at the University of Manchester.
The Multisim API Toolkit for LabVIEW defines countless applications to correlate measurements, sweep domain specific conditions and analyse performance with flexibility unavailable in conventional simulation environments. See also; Multisim circuit design applications at http://ni.com/multisim/applications/pro/
NI Multisim software; http://ni.com/multisim/