The group aims to establish common mechanical and electrical specifications for the development of advanced power conversion technology for distributed power systems. The ‘picoAMP’ standard, designed for the lower range of the spectrum for board-level conversion needs, provides designers with a non-isolated standards platform ranging from 6A to 18A. The standard defines a compact footprint of 12.2 x 12.2 mm in a land-grid-array (LGA) format.
The ‘picoAMP’ standard builds on the previously released ‘teraAMP’ standard for non-isolated digital point-of-load (POL) dc-dc converters, released in February 2015, and the ‘microAMP’ and ‘megaAMP’ standards released during November 2014. The first products to meet this new ‘picoAMP’ standard will be announced by AMP Group members later in the year.
The goal of the alliance between CUI, Ericsson Power Modules and Murata is to realise technically advanced, end-to-end solutions and provide a complete ecosystem of hardware, software and support. Beyond purely mechanical specifications, it is the standardisation of monitoring, control and communications functions, and the creation of common configuration files for plug-and-play interoperability that will ensure compatibility between each firms’ products.
Ericsson Power Modules; www.ericsson.com/powermodules