The new capabilities will enhance the company’s Bluetooth offerings which are subset solutions from the company’s low power connectivity standards relevant to the IoT, including NFC, ZigBee and Bluetooth Smart.
With mesh capability in its Bluetooth Smart solutions, NXP offers developers and manufacturers multi-node communication when developing devices and appliances for the smart home which include lighting, sensors, thermostats or other home Bluetooth Smart devices. In contrast to flooding in mesh networks, a technique which can generate “broadcast storms” and increase energy consumption, the NXP low power solution fully synchronises and routes protocols for efficient end-to-end connection between nodes. The NXP solution claims an order of magnitude improvement on energy efficiency for the whole network. The solution will also feature enhanced security and self-constructed networks with self-healing capability, and future proof layered-mesh architecture to support on top of standard Bluetooth Smart devices as well as over-the-air update capability for upgrading network after deployment.
“Interoperability, low power, and secure solutions are the underpinning technologies that will drive the next wave of wearables and smart devices in IoT,” said Asit Goel senior vice president and general manager for NXP’s secure monitoring and control business line. “By offering low power mesh capability to its Bluetooth Smart portfolio, NXP fortifies its commitment to delivering leading Bluetooth Smart solutions that best fit growing market trends and standards of the industry.”
NXP Semiconductors; http://www.nxp.com/products/microcontrollers/product_series/qn902x/