NXP embraces 28 nm FDSOI for MCUs

January 18, 2016 // By Peter Clarke
NXP is set to extend the use of 28 nm fully-depleted silicon-on-insulator (FDSOI) process technology down to its low-power LPC microcontrollers, according to Goeff Lees, newly installed as general manager of MCU business at NXP Semiconductors NV.

Lees was speaking at an event to intended to emphasise that the enlarged NXP, after its merger with Freescale, is well placed to offer processers, security and software for the Internet of Things in all of its various vertical applications, whether in the consumer, industrial, medical or automotive sectors.

Part of that emphasis is a mobile truck loaded with "show-and-tell" displays that will be driving around events in Europe and making its way to Embedded World, in Nuremburg, Germany at the end of February.

Truck-based exhibition of NXP expertise in IoT


Lees helped build up the microncontroller business at NXP as an early adopter of Cortex-M cores from ARM before changing jobs in 2012 and moving to Freescale to take on a similar task. However, while at Freescale Lees has also been exposed to higher order networking, communications and multimedia processors in the i.MX series and the decision to adopt Samsung's 28 nm FDSOI process.

With the merger of NXP and Freescale Lees has brought an enthusiasm for FDSOI into the enlarged company