Measuring at 0.8 x 0.8 x 0.35-mm, the new SOT1226 is a leadless plastic package 25-percent smaller than the SOT1115, previously the world’s smallest logic package, also from NXP.
Despite its smaller package size, the SOT1226 saves engineers time and costs by offering a 0.5-mm pad pitch that is 50-percent larger for easier soldering. Ideally suited for leading-edge portable devices such as smartphones where PCB space is critical, the unique form factor of the Diamond package enables device miniaturization by offering a space-saving logic solution without the added manufacturing costs associated with smaller pad pitch patterns.
Typical manufacturing processes for packages use a small 0.3-mm or 0.35-mm pad pitch, requiring Electronic Manufacturing Services (EMS) and assembly houses to use a step-down mask in order to successfully mount the devices on the PCB. Due to the Diamond package’s larger 0.5-mm pad pitch, a step-down mask is not needed during the soldering process, saving costs for the manufacturer. In addition, the larger pad pitch of the Diamond package offers greater contact area, resulting in easier component placement, as well as improved joint strength and robustness, while reducing the risk of short circuits.
With larger pad pitches, PCB assemblers can thus avoid costly mistakes such as solder bridging, or the formation of accidental bridges between contacts, which can render electrical devices useless.
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