Packaging innovations yield smaller, more robust 650V and 800V MOSFETs

January 31, 2014 // By Graham Prophet
STMicroelectronics is expanding three of its advanced high-voltage power MOSFET families with the introduction of two new power packages.

ST’s advanced PowerFLAT 5x6 HV and PowerFLAT 5x6 VHV packages provide the large insulation path lengths and clearances required for operation at up to 650V or 800V, within the same 5 x 6 mm footprint of a standard 100V PowerFLAT 5x6. This is 52% smaller than the DPAK footprint. In addition, the package is only 1mm high and features a large exposed metal drain pad that maximises heat dissipation into pc-board thermal vias. This increases high-voltage capability, ruggedness, reliability, and system power density.

Three 650V MDmesh V MOSFETs in the PowerFLAT 5x6 HV package are priced from $2.20 (1000) for the STL12N65M5, and four 800V SuperMESH 5 MOSFETs in the PowerFLAT 5x6 VHV package, which is optimised for very high voltage ratings are priced from $1.50 for the STL2N80K5. Also sampling are two 600 V fast-switching MDmesh II Plus low Qg MOSFETs in PowerFLAT 5x6 HV.