CEA-Leti, coordinator of the pan-European consortium EuroCPS, has announced that the 15 partners have set up the goals of their collaborative project to establish a network of design centres to help SMEs and large companies develop innovative products for emerging Internet of Things (IoT) markets. The group will use proven cyber-physical system (CPS) platforms and cooperation with research technology organisations (RTOs) or technology transfer-oriented university institutes who bring together a spectrum of technical and application knowledge to support innovation.
EuroCPS members are major European system suppliers, world-class research centres and technology providers, all rooted in the top European regional ecosystems. (see member list, next page)
Funded by the European Commission, the three-year, €9.2 million project is designed to help innovators (SMEs and large companies) overcome barriers they face when entering new markets because they lack both knowledge of the value chain and the skills to master the entire design process from ideas to products. EuroCPS partners will provide technical expertise, coaching and access to advanced industrial cyber-physical system platforms to get innovators up to speed on the innovation ecosystem of “smart” products by facilitating access to the latest technologies and their implementation. In the process, it will offer all the necessary expertise and competencies to provide innovators from any sector with a smooth path to building innovative CPS-enabled systems. It also will tap existing regional ecosystems in several countries to bring the full value chain – from hardware/software platforms to cyber-physical systems – to high value-added products and services.
One key goal of the project is to link software, system and nano-electronic industries along the full CPS value chain to demonstrate a new cooperation model. This will be demonstrated by 30 novel industrial experiments funded through three open calls for developing innovative CPS products that will help increase the competitiveness of the European innovative companies. The targeted products will be designed, constructed and built on the EuroCPS Platforms:
· Avionics platform provided by Thales
· Connectivity platform provided by Schneider
· INEMO platform provided by STMicroelectronics
· Integrated and open platform provided by AVL
· Power management platform provided by Infineon
· Quark platform provided by Intel
· Silicon processes and package technology platform provided by STMicroelectronics
· STM32F platform provided by STMicroelectronics
next page; consortium members...