Payment platform for secured and ultra-fast contactless transactions

November 17, 2015 // By Graham Prophet
Infineon says it has increased performance and security of contactless payment transactions with its SLC 32P family of security controllers, that can speed up data handling by the factor of 15. It enables manufacturers of payment cards, wearables and proximity devices such as tokens to meet requirements mandated by MasterCard from January 2016 onwards.

Faster data processing is key for contactless applications. It improves user experience and is a prerequisite for transport operators such as Transport for London (TfL) to accept payment cards in its contactless ticketing infrastructure.

The platform enables the development of payment cards that process EMV transactions well below the thresholds mandated by many payment schemes. EMV stands for Europay, MasterCard, and Visa who originally created a technical standard for payments with chip-based cards. MasterCard requires a card processing time below 300 msec for contactless products issued under their brand ( Source: MasterCard Contactless Performance Requirement Application Note No. 7 ).The SLC 32P product family runs at 100 MHz and will hence process information three times faster than current solutions. Data handling can speed up by a factor of 15.

Infineon’s SOLID FLASH technology combined with the new cell structure based on 65nm technology will speed up time to market of new products by more than 50%. Besides increased speed, the new payment platform provides significant security advantages compared to solutions currently available in the market, Infineon claims. The chip architecture is based on digital security technologies which are less vulnerable to attacks than analogue, sensor-based technology. The new components provide internal encryption and comprehensive error detection and hence state-of-the-art protection of payment credentials.

The SLC 32P payment platform addresses contact-based as well as contactless and dual interface payment applications and will gradually replace Infineon’s SLE 77 product family. Samples of the SLC 32P are available now. Certified products will be available in volume quantities from 2016 onwards. The new products are also taking advantage of Infineon’s innovative Coil On Module package solution which significantly simplifies production of Dual Interface cards.

Infineon: www.infineon.com/payment