PCI Express x4, Gen3 XMC carrier for embedded I/O applications

September 15, 2016 // By Graham Prophet
Tews Technologies (Halstenbek, Germany) has added to its range of PCI Express carriers with the TPCE278, a standard height PCI Express Revision 3.0 compatible module that provides one slot for a single-width XMC module.

This upgrades XMC I/O solutions to the PCI Express signalling standard used to build modular, flexible and cost effective I/O solutions for applications such as process control, medical systems, telecommunication and traffic control. The PCI Express x4 link from the host board to the XMC module is supported by a PCIe Gen3 Redriver, allowing safe operation of XMC modules on PCIe mainboards. VPWR is selectable between 12V and 5V via order option.


The TPCE278 supports XMC front panel I/O, and also P14 and P16 rear I/O, independently. XMC P14 rear I/O is provided through a Tyco AMPMODU System 50 0.050 x 0.100 flat ribbon cable connector. The I/O lines are routed differential. XMC P16 rear I/O is implemented through two Samtec QTH-DP 0.50 mm Q Pairs High Speed Ground Plane Socket Strip, Differential Pair connector providing access to all P16 I/O lines. The PCIe edge card connector provides +12V and +3.3V. The TPCE278 uses the +12V of the PCIe edge card connector to generate all power supply voltages for the XMC slot (+3.3V, VPWR and +12V).


According to the PCIe specification, a PCIe x4 card is limited to 25W on the +12V which allows to operate many of the available XMC modules on the TPCE278. For increased power requirements of an XMC module, TEWS offers TPCE278 variants with a PCIe Graphics Power Connector to supply the +12V for generating all the power supply voltages for the XMC slot providing power of up to 75W. A 10-pin JTAG header is available for XMC module debugging purposes. All five JTAG signals are routed directly to the XMC slot. The card operates from -40° to +85°C.


Tews Technologies; www.tews.com