Photorelays reduce PCB area with 1.5 x 2.2 mm packaging

May 18, 2015 // By Graham Prophet
Toshiba has added to its photorelays in what it claims as the smallest-available package; the high voltage photorelays have low off-state capacitance and low on-state resistance.

Six additional products are housed in a VSON4 package - the smallest for photocoupler products. The devices support trigger LED currents of 3 mA (max.) and isolation voltage of 300 Vrms(min.). By expanding the variation of voltage and "C × R", the photorelays can support a variety of applications including semiconductor testers, measurement equipment, automatic test equipment as well as working as replacements to reed relays.

The new products have the same electrical characteristics as Toshiba’s small-size package USOP4 series, but reduce required assembly area by approximately 50% by using the VSON4 package that measures just 1.5 x 2.5 x 1.3 mm thick. The line-up includes TLP3442, with lowest off-state capacitance (COFF), 0.3 pF (typ.), and TLP3431, which is suited for use in high-frequency signal transmission with a low on-state resistance (RON) of 0.8 Ohm (typ.).

Toshiba Electronics Europe;