The LX5509 is the first commercially available PA that can transmit at similar power levels in both IEEE 802.11n and IEEE 802.11ac networks, allowing optimum system performance by extending the high data rate range.
In addition to its power capabilities, the LX5509 features a standardized pin out. This enables customers to, without layout changes, later upgrade the performance level in their systems with higher power 5 GHz PAs that are currently in development at Microsemi.
Microsemi’s 802.11ac solution offerings include the LX5586, the world’s first monolithic silicon germanium (SiGe) RF front-end (FE) device. The company recently announced that this innovative solution works in conjunction with Broadcom’s BCM4335 combo chip for mobile platforms.
The company also offers a broad portfolio of IEEE 802.11a/b/g/n solutions including power amplifiers, low noise amplifiers, front- end modules and reference designs co-developed with leading WLAN chipset manufacturers.
The LX5509 produces a linear output power of 19 dBm for IEEE 802.11ac 256-QAM 80 MHz, EVM < 1.8% @3.3 V or a linear output power of 20 dBm for IEEE 802.11n 64-QAM 20 MHz, EVM < 3% @3.3 V.
The device offers am28 dB OFDM power gain and has a 50-ohm input and output match, eliminating the need to optimize output matching on the PCB. The LX5509 also features an integrated harmonic filter and output detector and a temperature-compensated on-chip output power detector with wide dynamic range.
Availability and Packaging
The LX5509 is packaged in a 4 mm x 4 mm quad flat no-lead (QFN) package and is available now for sampling.
Visit Microsemi at www.microsemi.com