Power management for low-power connected devices

February 26, 2014 // By Graham Prophet
Freescale has enlarged its range of programmable power management ICs for power-constrained connected devices; this PF Series PMIC is optimised for i.MX 6 applications processor systems. The company has also shrunk its smallest MCU package still further.

The MMPF0200 device joins the PF Series of highly programmable power management ICs (PMICs) that Freescale designed to work in systems based on its i.MX 6Solo, i.MX 6SoloLite and i.MX 6DualLite applications processors. Configurability and quick-turn programmability of the MMPF0200 makes it suitable for power-sensitive platforms including portable medical devices, IP headphones, home security systems, IPTV controllers, tablets and home energy management solutions. MMPF0200 is also designed to be Auto AEC-Q100 Grade 3-compliant for automotive applications such as infotainment systems. The device’s fully configurable architecture supports numerous outputs with various current ratings and programmable voltages, allowing it to work as a system-level power solution supporting the core processor, memory and peripherals.

Key features of the PF0200 PMIC include: input voltage: 2.8–4.5 V; buck converters with up to four outputs - 1 x 2.5A single/dual phase, 1 x 1.5 A, 1 x 2.5 A or 2 x 1.25 A.

There is dynamic voltage scaling; PWM, PFM and APS switching modes with an adjustable switching frequency of1, 2 or 4 MHz: a 5.0 V boost regulator supplies 1 x 600 mA with OTG support, and there are six LDOs. Programming spans output voltage, current limit, switching mode, soft start and frequency, with independent on, off and standby mode programming, and programmable startup sequence and timing. An RTC supply provides 1.0–3.0 V at 400 μA and there is a DDR reference voltage, and a coin cell charger. The device will cost $2.38 (10,000). More information; www.freescale.com/pmic

The Kinetis KL03 MCU cuts the package size of the prior KL02 device, and adds features, in a1.6 x 2.0 mm package. Using advanced wafer-level chip scale packaging, the Kinetis KL03 MCU is more than 15% smaller than the KL02 device, and 35% smaller than competing 32-bit ARM MCUs. 

The Kinetis KL03 MCU combines the power efficiency of the Kinetis L series based on ARM Cortex- M0+ cores with enhanced low-power functionalities including register files, SRTC, low