Power module drives automotive brushless motors

July 28, 2016 // By Graham Prophet
This automotive Power Integrated Module for next-generation automotive BLDC systems is a high-integration device featuring 30A, 40V MOSFETs for more compact, streamlined and reliable motor drives.

Joining a range of automotive Power Integrated Modules (PIMs), the STK984-190-E is optimized for driving 3-phase brushless DC motors in automotive applications, and contains six 40V, 30A MOSFETs configured as a three-phase bridge with an additional 40V, 30A high-side reverse battery protection MOSFET. The MOSFETs are mounted onto a direct bonded copper (DBC) substrate, resulting in a compact module with excellent thermal performance taking up only half of the board space used by an equivalent discrete solution.


The module is suitable for use in 12 V automotive electric motor drive applications with power ratings up to 300W, such as electric pumps, fans and windscreen wipers. Used in combination with motor controllers, such as LV8907UW, designers can build high efficiency BLDC solution with thermal performance, built in diagnostics, and a small PCB that saves critical size and weight.


The module allows both the component count and the bill of materials costs to be reduced substantially. The DBC substrate reduces the thermal resistance, which reduces the operating temperature of the MOSFETs. This reduces power losses and increases reliability due to a reduced change in temperature during thermal cycling. Reliability is also improved by the isolation provided by the DBC substrate. STK984-190-E has a specified operational temperature range of -40°C to 150°C. The integrated MOSFETs are all AEC-Q101 qualified.


The company adds, “At least 13-15 discrete components would typically be needed to develop an effective BLDC drive solution, whereas the STK984-190-E automotive power module needs less than half that... in addition to its compact size, the strong thermal performance of the STK984-190-E allows a smaller heatsink to be employed.”


In a DIP-S3 outline 29.6 x 18.2 x 4.3 mm it is priced at $3.50 (16).


ON Semiconductor; www.onsemi.com