By utilizing an innovative packaging solution, the µIPM family delivers a new benchmark in device size, offering up to a 60 percent smaller footprint than existing 3-phase motor control power ICs.
Available in an ultra-compact 12x12x0.9 mm PQFN package, the µIPM family comprises a series of fully integrated 3-phase surface-mount motor control circuit solutions. The new approach pioneered by IR for this market segment utilizes PCB copper traces to dissipate heat from the module, providing cost savings through a smaller package design and even eliminating the need for an external heat sink. By using standard packaging QFN technology, assembly is simplified by eliminating through-hole second pass assembly and improving thermal performance compared to traditional dual-in-line module solutions.
IR's µIPM product family offers a scalable power solution with common pin-out and package size. Featuring the most rugged and efficient high-voltage FredFET MOSFET switches specifically optimized for variable frequency drives and IR's most advanced high-voltage driver ICs, the µIPM product family offers DC current ratings ranging from 2 A to 4 A and voltages of 250 V and 500 V.
Availability and Pricing
Pricing for the released µIPM family ranges from US $1.59 to US $2.99 each in 10,000 unit quantities. Production quantities are available immediately. The devices are RoHS compliant.
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