With the BORA module designers can save time and resources by using a compact solution that includes both a CPU and an FPGA, avoiding complexities on the carrier PCB. The use of this processor enables extensive system-level differentiation of new applications where high perfomance and extremely compact form factor (85mm x 50mm) are important.
BORA offers computational power, with rich set of peripherals, the Dual Cortex-A9 and the Artix-7 FPGA and high-speed I/Os (up to 5 GHz). With the FPGA integrated on-chip customers can develop simply their intelligent smart embedded system without sacrificing performance and keeping power to a minimum.
BORA enables designers to create rugged products suitable for harsh mechanical and thermal environments, allowing the development of the most advanced and robust products. The use of FPGA banks with a wide range voltage input from 1.2V to 3.3V, allows you to have more flexibility, simplicity and economy to create aproject. The module also includes internal voltage and power monitoring which gives enhanced security and reliability.
Thanks to the tight integration between the ARM-based processing system and the on-chip programmable logic, designers are free to add virtually any peripheral or create custom accelerators that extend system performance and better match specific application requirements.
“The Bora CPU module is the perfect solution for customers that require very high performances and want to focus on software security and reliability leaving to DAVE the responsibility to provide them an hardware solution easy to integrate that can be used in every critical mission” said Manuele Papais Sales Manager of DAVE. “Our market is requesting to provide solutions and not only embedded hardware," said Stefano Dal Poz, CEO of DAVE. "The BORA CPU module is in-line with these market expectations and we are excited to propose our customers this platform which combines perfectly Xilinx's know-How and our expertise in high-end solutions.”