The agreement will, say the two conpanies, enable the rapid introduction of NFC and eSE on Snapdragon-based devices in a broad range of consumer applications. New reference designs are expected to expand the reach of NFC beyond the smartphone and into other applications such as home automation, consumer electronics, automotive, smart appliances, personal computing and wearables.
“NXP’s NFC and eSE chipsets are a natural addition to Qualcomm Technologies’ platforms, given NXP’s expertise in enabling secure transactions,” said Dr. Cormac Conroy, vice president, Qualcomm Technologies, Inc.
The availability of NXP’s NFC and eSE solutions for Snapdragon platforms will help accelerate the deployment of secure transactions into new applications, such as mobile payments and digital identity for mobile, automotive and Internet of Everything (IoE) segments, complementing Qualcomm Technologies’ security solutions. The new offering will feature the NQ220 module, which was derived from the recently launched NXP PN66T module. The NQ220 is designed to enable service providers to easily deliver new applications by simplifying the process of deploying credentials to devices, significantly reducing design costs and time-to-market considerations for mobile wallets and additional applications such as prepaid payment, transit and access control.
“We continue to see the market use and acceptance of NFC grow daily, with new applications being created at an astounding rate. Collaborating with Qualcomm Technologies to provide full eSE and NFC functionality on its industry-leading platforms will further expand this growth potential,” said Rafael Sotomayor, senior vice president, NXP Semiconductors.
The NQ220 reference design is available now.
NXP Semiconductors; http://nxp.com