Reliability-prediction software updated

May 06, 2015 // By Susan Nordyk, EDN
The combination of substrate trace modelling and deeper integration with Abaqus and ANSYS Workbench allows rapid and detailed modelling of all substrate features, providing thermal and mechanical simulation teams with greater insight into next-generation IC packaging, such as coreless substrates, ultrathin BGAs (

Other features of Sherlock V4.0 include lead modelling of surface-mount and through-hole components, shock scoring, an expanded cutout editor, and a heat-sink editor. Designers can automatically specify lead structures and heat-sink architecture for all electronic parts using Sherlock’s lead modeller and heat-sink creator. Shock scoring enables OEM engineers to assess the performance of electronics that are subjected to repeated shock, such as door and trunk[boot]-mount electronics in cars, and wearable electronics embedded in athletic gear. In addition to shock and vibration, Sherlock assessment options include thermal, time to failure, and part failure.

DfR Solutions offers a three-week free trial of Sherlock software, along with a 90-minute training session.

DfR Solutions, www.dfrsolutions.com