Comprising four 60 V N-Channel MOSFETs and using Fairchild's GreenBridge technology, the FDMQ86530L solution improves the conduction loss and efficiency of the conventional diode bridge providing a ten-fold improvement in power dissipation. Available in a thermally enhanced, space-saving 4.5 x 5.0 mm MLP 12-lead package, the device eliminates the need for a heat sink enabling a compact design that increases power conversion efficiency in 12 and 24 V AC applications.
A typical application where excessive heat generation is a problem is in compact active bridge applications such as network cameras, where there can be image quality issues. Thermally induced noise can also affect the system's image sensors which can also degrade the camera's picture quality. The typical heat sinking solution to regulate thermal fluctuations can further complicate these intricate designs with added component count and cluttered board space.
The FDMQ86530L product is available in a 4.5 x 5.0 mm MLP 12-lead package and is priced at $1.38.
Fairchild Semi; www.fairchildsemi.com/cf/