Rogers to showcase high performance PCB Materials

October 22, 2012 // By Jean-Pierre Joosting
Rogers Corporation will be offering practical guidance on the optimal use of their high performance printed circuit board (PCB) materials at the 2012 European Microwave Week commencing October 29.

Visitors can learn more about a wide range of high-performance circuit materials, including RT/duroid® 6035HTC laminates and 2929 bondply material. RT/duroid 6035HTC laminates are ceramic-filled PTFE composite materials well suited for high power RF and microwave applications, including in couplers, filters, power dividers/combiners, and power amplifiers.

These high performance materials incorporate a unique filler material to achieve a relative dielectric constant of 3.5 in the z-axis at 10 GHz with extremely high thermal conductivity of 1.44 W/m-K. The high thermal conductivity, combined with a low loss tangent of 0.0013 at 10 GHz, enables circuit designers to optimize gain and efficiency in high-power amplifiers.

2929 bondply material is an unreinforced thermoset resin based thin film adhesive system for constructing multilayer circuits. This is a low loss circuit adhesive, with a dielectric constant of 2.94 in the z-axis at 10 GHz and loss tangent of less than 0.003 in the z-axis at 10 GHz. The 2929 bondply materials are based on a proprietary cross-linking resin system and compatible with sequential bond processing techniques. They are also ideal for creating multilayer circuits with many of the company’s high performance PCB materials, including RO3000® and RO4000® laminates.