Visitors can learn more about a wide range of high-performance circuit materials, including RT/duroid® 6035HTC laminates and 2929 bondply material. RT/duroid 6035HTC laminates are ceramic-filled PTFE composite materials well suited for high power RF and microwave applications, including in couplers, filters, power dividers/combiners, and power amplifiers.
These high performance materials incorporate a unique filler material to achieve a relative dielectric constant of 3.5 in the z-axis at 10 GHz with extremely high thermal conductivity of 1.44 W/m-K. The high thermal conductivity, combined with a low loss tangent of 0.0013 at 10 GHz, enables circuit designers to optimize gain and efficiency in high-power amplifiers.
2929 bondply material is an unreinforced thermoset resin based thin film adhesive system for constructing multilayer circuits. This is a low loss circuit adhesive, with a dielectric constant of 2.94 in the z-axis at 10 GHz and loss tangent of less than 0.003 in the z-axis at 10 GHz. The 2929 bondply materials are based on a proprietary cross-linking resin system and compatible with sequential bond processing techniques. They are also ideal for creating multilayer circuits with many of the company’s high performance PCB materials, including RO3000® and RO4000® laminates.