As portable devices such smartphones and digital cameras get smaller and more sophisticated, thinner, more compact components are required. However, until now, problems related to internal element miniaturization, bonding stability, package process accuracy, and surface mount technology limit the smallest conventional transistors to the 1006 size (1.0 mm × 0.6 mm, t=0.37 mm).
ROHM was able to overcome these challenges by utilizing a smaller element and high-precision package process technology, resulting in a compact form factor. In addition, optimized external and terminal dimensions improve mountability while facilitating mass production.
ROHM is offering the new package for small-signal MOSFETs, reducing mounting area and thickness by 67% and 28%, respectively, compared with conventional 1212-sized (1.2 mm × 1.2 mm, t=0.5 mm) products while still maintaining characteristics and performance. Future implementations will include bipolar and digital transistors, which are expected to contribute to end-product miniaturization and higher-density designs for circuit applications of all types.
Visit ROHM Semiconductor at www.rohm.com/eu