Samtec expands 28/56 Gbps backplane connector system

October 20, 2016 // By Graham Prophet
Samtec's ExaMAX High-Speed Backplane Connector System is preseted as capable of 28 Gbps today, with a path to 56 Gbps, and is optimized for high-density and high-speed performance. Additions to the portfolio include new wafer sizes and power and guidance modules

The ExaMAX header and right-angle receptacle system (EBTM/EBTF-RA Series) is optimized for speeds up to 28 Gbps on a 2.00 mm column pitch or 56 Gbps on a 3.00 mm column pitch. For 28 Gbps performance, this system meets and exceeds OIF-CEI-28G-LR specifications. Return loss compliance is achieved in both 85Ω and 100Ω systems due to targeting the 92Ω specifications and controlling reflections at all geometry transitions within the connector.

 

Samtec’s ExaMAX system claims the industry’s lowest mating force with excellent normal force and meets Telcordia GR-1217 CORE specifications. With two reliable points of contact at all times, even when subjected to angled mating, residual stub is minimized for improved signal integrity performance. A 2.4 mm contact wipe increases reliability while the hermaphroditic mating interface ensures stub-free mating and reliable alignment.

 

The backplane system features individual signal wafers with differential pairs in a staggered design and arranged in columns with zero skew. Each wafer includes a one-piece embossed ground structure, which increases isolation to significantly decrease crosstalk. The 2.00 mm-pitch, 40-differential-pair design (4 pairs x 10 columns) and the 72-differential-pair design (6 pairs x 12 columns) are now available. A 3.00 mm-column-pitch design for 56 Gbps performance is in development.

Optional add-on power modules support high current delivery with current ratings as high as 80A per module. Hot-swapping support comes from various pin staging options for detecting shorts. Optional discrete guidance modules are available to assist with blind mating. Ruggedized construction enables support for maximum weight in a space saving design.

 

“Samtec’s expansion of our ExaMAX® High-Speed Backplane Connector System provides engineers increased options as they consider current and future high-speed backplane architectures,” says Rick Skees, Samtec’s High-Speed Backplane Product Manager. “These new additions to our ExaMAX portfolio will not be our last. We are currently developing new options for various orientations including coplanar, mid-plane orthogonal and direct-mate orthogonal (DMO.)”

 

To learn more about the ExaMAX