The package contains Cypress’s 3V 512-Mbit HyperFlash and 64-Mbit HyperRAM memories in a multi-chip package (MCP) measuring only 8 by 6 mm. The MCP combines a high-speed NOR flash memory for fast-boot, instant-on capability with a self-refresh DRAM for expanded scratchpad memory in a low-pin-count package for space-constrained and cost-optimized embedded designs. The solution is aimed at applications including automotive clusters and infotainment systems, communication equipment, industrial systems and high-performance consumer products.
The MCP uses Cypress’s 12-pin HyperBus interface and is housed in a 24-ball ball grid array (BGA) package that shares a common footprint with both discrete HyperFlash and HyperRAM products. This common footprint enables design engineers to implement a single-pad layout that supports either discrete device or the HyperFlash and HyperRAM MCP, allowing changes at any point in the design or product lifecycle without affecting board layout. This flexibility enables differentiated end products based on a single platform design.
“Cypress first introduced the HyperFlash and HyperRAM memory products to provide reliable high-performance, low-pin-count solutions that reside on a single 12-pin HyperBus to simplify embedded system board design,” said Rainer Hoehler, Vice President of the Flash Business Unit at Cypress. “The HyperFlash and HyperRAM MCP is the next logical progression. It is an optimum solution to get a full high-performance memory subsystem with 70% fewer pins and a 77% smaller footprint compared to existing SDRAM and Quad SPI solutions.”
Customers and partners developing FPGA, ASIC or AASSP solutions, receive Cypress’s support through a HyperBus Master Interface Controller IP Package. Customers can integrate this IP into their host controller platform. The Controller IP supports both HyperFlash and HyperRAM products and is free of charge and royalty-free.
The HyperFlash and HyperRAM MCP is offered in the industrial (-40°C to +85°C) and industrial-plus (-40°C to +105°C) temperature ranges. Both temperature ranges are also available with AEC-Q100 automotive qualification and with production part approval process (PPAP) support.