Server-on-modules with new Intel Xeon/Core processors

October 30, 2015 // By Graham Prophet
congatec's COM Express Basic modules with the latest Intel Core and Intel Xeon processors deliver embedded performance that the company rates as server-class, for embedded designs that operate within a thermal power envelope of 25-45W TDP and require custom I/O and IoT interfaces.

congatec (Deggendorf, Germany) has expanded its COM Express Basic portfolio with server-class embedded modules. The new Server-on-Modules are equipped with 6th generation Intel Xeon and Intel Core i3 / i5 / i7 processors (codenamed Skylake). The DDR4 memory of the conga-TS170 modules provides up to twice as much system memory performance for data-intensive applications while consuming 20% less energy and requiring only half the footprint of DDR3 RAM that is expected to become legacy in future applications. The modules offer faster processor speeds, a 60% accelerated system bus and an enlarged Intel Smart Cache (up to 8 MB) as well as the PCIe Gen 3.0 support for all PCIe Lanes and the new Intel HD Graphics P530.

TS170 modules equipped with Intel Core processors are suitable for applications including test and measurement equipment, back-end systems in medical imaging, high-performance industrial workload stations as well as intelligent vending machines.

The Intel Xeon module variants additionally provide ECC memory protection, which extends their usage to data critical server and gateway applications. Applications can be found in industrial IoT and cloud servers with big data analytics, carrier-grade edge node servers as well as connected Industry 4.0 automation servers that host multiple virtual machines or media servers with multiple stream real-time video transcoding.

The modules offer powerful tools to manage distributed IoT, M2M and Industry 4.0 applications. With Intel vPro technology and congatec's board management controller with watchdog timer and power loss control, the modules are fully equipped for remote monitoring, management and maintenance tasks, right down to out-of-band management. For cost-sensitive applications that do not necessarily require complex out-of-band management or virtualisation, modules based on the Intel Core i3 processor and the Mobile Intel HM170 chipset are also available.

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The conga-TS170 modules are equipped with the latest 6th generation 14nm Xeon v5 and Intel Core processors. They feature a TDP of 25-45W, up to 8 MB smart cache